GIGABYTE GA-B75M-D2V

GA-B75M-D2V S1155 B75 MATX CPNT SND+GLN+UB3 SA

Identificador:140276
Marca:GIGABYTE
P/N:GA-B75M-D2V
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Stock:Sin Stock
GA-B75M-D2V S1155 B75 MATX CPNT SND+GLN+UB3 SA
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51.55
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LGA1155 Socket/Intel B75 Express Chipset, 2x DDR3 DIMM (up to 16GB), 1600/1333/1066 MHz, 4x USB 2.0, 2x USB 3.0, D-Sub/DVI-D, Gigabit Ethernet, SATA 3/6Gbps, High Definition Audio, AMI EFI BIOS, Micro ATX

GA-B75M-D2V S1155 B75 MATX CPNT SND+GLN+UB3 SA

Intel® Small Business Advantage

GIGABYTE B75 series motherboards possess a range of features that are designed to offer vastly improved and simplified control over unmanaged IT infrastructure, with specific focus on security, data backup and raising productivity levels overall...more

Humidity Protection
Humidity can play havoc on a motherboard's circuitry.GIGABYTE's new Glass Fabric PCB design helps protect against electrical shorts due to humidity by reducing the gaps in spacing between PCB filaments.

Electrostatic Protection
GIGABYTE Ultra Durable 4 Classic motherboards feature High Resistance ICs which help protect the motherboard against electrostatic discharge.

Power Failure Protection
GIGABYTE uses Anti-Surge ICs to protect the motherboard against power surges.

High Temperature Protection
GIGABYTE uses All Solid Caps (Capacitors) and Low RDS(on) MOSFETs which are rated to work at higher temperatures, providing up to 50,000* hour component lifespan.

3rd Generation Intel® Core™ processors
New 3rd generation Intel® Core™ processors are based on the new 3rd generation Intel® Core™ processor architecture, manufactured using the latest 22nm process to create a visually optimized processor platform. Based on the mature LGA 1155 socket, 3rd generation Intel® Core™ processors feature up to four high-performance 64-bit processor cores and 8MB of L3 cache Smart Cache, and overall performance when you need it most.

Designed for PCI Express Gen.3 Support
GIGABYTE 7 series motherboards take advantage of the latest connectivity and expansion bus technologies available on the Intel platform. The 3rd generation Intel® Core™ processor platform debuts the new PCI Express gen. 3.0 expansion bus, allowing users to take advantage of the next generation, high-bandwidth discrete graphics card solutions.

Intel® Rapid Start Technology
Intel® Rapid Start Technology™ gets your device up and running faster from even the deepest sleep. This means users will be able to experience almost zero power draw from their PC, but be able to resume Windows® 7 is a few seconds without having the PC go through a full system boot. With Intel® Rapid Start Technology the previous session resumes to the exact as it was, so that applications are still in the same state and no application data is lost.

Intel® Smart Connect Technology
Intel® Smart Connect Technology means that your email, favorite apps, and social networks are continually and automatically updated even when the system is asleep. No more waiting for the latest world news or friends' updates to be delivered—just press the 'on' button and you're up-to-date and ready to go.

Auto Sync with Cloud
No manual interaction required to synchronize with cloud services.

Data Ready
Email, social media, and cloud apps always updated and available at power on.

Intel® Quick Sync 2.0

Faster media encoding performance
Saves your valuable time when create and edit video, synchronize it with other devices, and share it–at home and on the internet. Intel Quick Sync Video uses hardware on the processor, instead of software, to accelerate video encoding.

DirectX 11 Support

Better Visual Experience
Microsoft DirectX 11 provides eye-popping 3D visuals found for today's latest PC games and is designed to be more efficient, leverage the power of today's multi-core processors, and provide support for sophisticated shading and texturing techniques such as tessellation.

50,000 Hours Solid Capacitors
GIGABYTE Ultra Durable motherboards are equipped with solid capacitors. With an average lifespan of 50,000 hours, these solid capacitors provide the stability, reliability and longevity essential to meet the power needs of high-end processors and other components running today's most demanding applications and games.

SuperSpeed USB 3.0
GIGABYTE motherboards boast SuperSpeed USB 3.0 technology made possible through an additional onboard host controller. With superfast transfer rates of up to 5 Gbps, users are able to experience a theoretical 10x improvement over USB 2.0. Additionally, backwards compatibility with USB 2.0 assures users of long term use of their legacy USB 2.0 devices.

SATA 6 Gbps
GIGABYTE motherboards are High-Speed SATA Revision 3.0 compatible, delivering superfast 6Gbps link speeds for twice the data transfer rates of SATA Revision 2.0 (3 Gbps).

On/Off Charge Technology
GIGABYTE On/Off Charge technology allows you to charge your iPhone, iPad and iPod Touch regardless of whether your PC is on, in standby mode or even off. A derivative of GIGABYTE's highly acclaimed 3x USB Power feature, On/Off Charge enables devices to draw more current from GIGABYTE motherboard USB ports than standard USB ports allow, so that charging from your PC can be as fast as with a charger...more

DVI Support
DVI (Digital Visual Interface) is a video interface standard designed for carrying uncompressed digital video data and to maximize the visual quality of digital display devices, such as LCD monitors, digital projectors, and so on. In addition, the DVI interface is compatible with HDCP (High-bandwidth Digital Content Protection).

ErP Lot 6 support
The ErP (also known as Energy-Related Products Directive) is part of the European Union's environmental regulations policy. It is based on concern for the environmental as the proliferation of electronic devices continues, and how to improve energy efficiency for a better and greener life. GIGABYTE supports ErP and produces motherboards that help you effectively improve system efficiency.

Más información: GA-B75M-D2V
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ReferenciaGIGABYTE GA-B75M-D2V
支持的内存类型DDR3-SDRAM
内存插槽数量2
内存插槽类型DIMM
内存通道支持dual
内存电压1.5
无错误检测和更正
可支持内存时钟速度1066, 1333, 1600
最大内部存储16
处理器系列Intel
兼容处理器Celeron, Core i3, Core i5, Core i7
处理器插槽Socket H2(1155)
SMP(适用于表面安装的封装形式)处理器的最大数量1
Intel Core i3/i5/i7 seriesi3-2xxx, i3-3xxx, i5-2xxx, i5-3xxx, i7-2xxx, i7-3xxx
USB 2.0接口2
USB 3.0接口1
串列ATA连接器数量6
CPU风扇接口
ATX电源接头
前面板音频接头
风扇电源接头
SATA 2连接器数量5
SATA 3连接器数量1
USB2.0端口的数量4
USB3.0端口的数量2
以太网路(RJ-45)连接接口数量1
PS/2连接埠数量2
喇叭/耳机/音频输出插孔1
麦克风/音频输入插孔
VGA (D-Sub)接口数量1
DVI-D接口数量1
组件PC
主板芯片组家族Intel
主板晶片Intel B75
主板元件micro ATX
支持硬盘驱动器接口Serial ATA II, Serial ATA III
并行处理技术支持
冷却方式passive
可支持处理器数量1
Audio output channels7.1
音频系统HD
PCI Express × 1插槽2
PCI Express x16 插槽1
PCI Express插槽版本2.0, 3.0
宽度226
深度174
以太网连接器
以太网接口类型Gigabit
directx版本11
最大分辨率1920 x 1200
可支持的Windows操作系统Windows 7 Home Basic, Windows 7 Home Basic x64, Windows 7 Home Premium, Windows 7 Home Premium x64, Windows 7 Professional, Windows 7 Professional x64, Windows 7 Starter, Windows 7 Starter x64, Windows 7 Ultimate, Windows 7 Ultimate x64, Windows 8, Windows 8 Enterprise, Windows 8 Enterprise x64, Windows 8 Pro, Windows 8 Pro x64, Windows 8 x64, Windows XP Home, Windows XP Home x64, Windows XP Professional, Windows XP Professional x64
基本输入输出系统类型EFI AMI
ACPI的版本2.0a
清除CMOS跳线
源数据表icecat
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